Apple plans to shift iPhone chip assembly and packaging to India, strengthening the country’s semiconductor ecosystem and reducing reliance on China.
Apple is reportedly planning to move iPhone chip assembly and packaging operations to India, marking a significant shift in the global semiconductor and electronics supply chain. Chip assembly and packaging is the final and most critical stage after chip fabrication, which still largely takes place in Taiwan.
By bringing this high-value process to India, Apple is not only expanding iPhone assembly but also strengthening India’s role in advanced semiconductor manufacturing. This move aligns with Apple’s China+1 strategy to reduce dependence on China amid rising geopolitical risks.
India’s Production Linked Incentive (PLI) schemes, improving electronics manufacturing ecosystem, and availability of skilled engineering talent have made the country an attractive destination. Companies such as Foxconn, Tata, and Pegatron are already playing a key role in Apple’s India strategy.
The shift is expected to boost India’s semiconductor ecosystem, create high-tech jobs, and improve the country’s position in global value chains. In the long term, it also sends a positive signal for foreign direct investment (FDI) and technology-focused manufacturing stocks.